Automotive Lamp Thermal-Optical-Structural Simulation
Multiphysics simulation of lamp assemblies: LED thermal management, SPEOS lighting and structural strength.
≤ 105 ℃
LED junction temp.
ECE R112
Lighting regulation
−40%
Development cycle
Thermal · Optical · Structural
Coupled physics
Simulation approach
Thermal management: ANSYS Icepak / Fluent evaluate LED junction temperature, heat sink and airflow design, controlling PCB and light-source temperature across all conditions to avoid lumen depreciation and reduced life.
Optical lighting: ANSYS SPEOS simulates lighting distribution and regulatory compliance (low/high-beam illuminance, cut-off line), optimizing on a virtual prototype.
Structural & vibration: ANSYS Mechanical checks strength, modes and sealing reliability of the lamp body under random road vibration and thermal cycling.
Value
Closes the loop on cooling, lighting uniformity and structural reliability early in design, cutting prototype and road-test iterations and greatly shortening the lamp development cycle.
Shanghai T-Solutions has long provided ANSYS application, customization and technical exchange support for the automotive lighting industry, accumulating a complete multiphysics lamp-simulation workflow.
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STSC
Shanghai T-Solutions Co., Ltd.